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We consistently count visitor registration numbers clearly and stringently and, without deception, continue to release the real numbers.
| [Fundamental Philosophy of the Totalled Visitor Numbers] |
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The number of visitors will be stated honestly and will not be inflated. This is our duty to exhibitors. |
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The inflation of visitor numbers is a misrepresentation of the contents of the exhibition and fraudulent to the exhibitors. |
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The number of visitors and also the counting method will be stringently announced in writing shortly after the exhibition. |
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| [Three Major Principles of the Counting Method] |
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Only those who visit the exhibition and complete registration on-site are counted. |
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Once registered, a visitor is counted only once, no matter how many times and days they enter the exhibition. |
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Counting the visitors each time they pass through the entrance is regarded as an actual inflation of the figures, therefore, this counting method is prohibited. |
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| ICP 2009 Visitors List (by company name, in alphabetical order) |
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ICP Exhibitors participate in this exhibition to negotiate with the visitors, not just to announce out their products and technologies. Exhibitors comment that they managed to have good business negotiations leading to large contracts. |
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ICP 2009 Exhibitors comment... (Extracted) |
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JCTECH CO., LTD. / NANTONG FUJITSU MICROELECTRONICS CO., LTD. (CHINA)
SATS |
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NAGASE & CO., LTD. (JAPAN) /
PAC TECH GMBH (GERMANY)
Bumping Equipment and Services |
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First time participation. Together with our Chinese business partner, NANTONG FUJITSU MICROELECTRONICS, we aimed to expand business and increase name recognition. We met 600 new customers, and achieved very specific inquiries. |
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We invited VIP customers and prospects to show our bumping equipment demo. Actually showing the equipment pushes negotiations forward, and we achieved 10 inquiries which will bring 100 million JPY (1 million US$) within this year. |
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AGILENT TECHNOLOGIES
(JAPAN/USA)
X-Ray Inspection |
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FUJITSU INTEGRATED MICROTECHNOLOGY LTD.
(JAPAN)
SATS |
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We exhibit at this show as one of our most business-leading sales strategies. This year, we achieved 30 inquiries, which are expected to sum up to 100 million JPY (1 million US$) sales |
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From the leads we had in 2008, we achieved an order of 1 million US$ |
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DISCO CORP.
(JAPAN)
Dicing Equipment |
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SMIC - SENJU METAL INDUSTRY CO., LTD.
(JAPAN)
Soldering |
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600 visitors came to our booth, most with specific technical needs. Every year, visitors at ICP are highly-motivated and therefore is the best place for us to reach a larger customer base. |
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We exhibited in both SMT and IC Packaging areas, and gathered 1,500 customers and 150 leads. We expect sales of over several hundred million JPY (several millions of US$). |
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ICP 2009 Visitors comment... (Extracted) |
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TOSHIBA CORP., SEMICONDUCTOR COMPANY
Product Technology Div. |
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NEC ELECTRONICS CORP.
Compound Devices Business Gr., Manufacturing Technology Div. |
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We are now evaluating samples for new packaging materials from a supplier we found at ICP. It will be an order of more than 100 million JPY (1 million US$). As ICP has all the materials suppliers exhibiting, it is very efficient for us to meet them all. |
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We focused especially on exhibitors we had appointments with, and those who had new products. We are now finalizing an order of a packaging equipment worth 17 million JPY (170,000 US$). |
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THE FURUKAWA ELECTRIC CO., LTD.
Automotive Components Div. |
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RENESAS TECHNOLOGY CORP.
RF/Power Devices Development Div. |
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We will buy a wire bonder we found at ICP for 30 million JPY (300,000 US$). Also, we are now discussing details on inspection equipment with 3 companies. This should be an order of 100 million JPY (1 million US$). |
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We visited ICP to buy a plating equipment, and we made appointments with several exhibitors. Actually looking at the equipment and demos helped us decide fast, and we plan to buy this for more than 100 million JPY (1 million US$). |
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NTT ELECTRONICS CORP.
Electronics Div. |
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AKITA ELPIDA MEMORY, INC.
Advanced Packaging Development Gr. |
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We visit ICP every year. This time, we looked for partners to outsource our packaging and we decided on one for 1 million JPY (10,000 US$). This is still a small amount, but we look to outsource more as soon as prototype manufacturing is finished. |
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We came to look for solutions for our new product development. We spent 2 days on meetings with exhibitors and to find new suppliers. We found several products we would like to purchase, and we asked for test samples. |
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Take your opportunity to participate and expand your business in the Asia's Electronics Manufacturing market !! |
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| Contact Us |
IC PACKAGING TECHNOLOGY EXPO Show Management
Attn: Kanako Otsuka (Ms.), Hajime Suzuki (Mr.), Taikoku Kin (Mr.)
Reed Exhibitions Japan Ltd.
18F Shinjuku-Nomura Bldg., 1-26-2 Nishishinjuku, Shinjuku-ku, Tokyo 163-0570, Japan
TEL: +81-3-3349-8502 FAX: +81-3-3349-4900
E-mail: inw@reedexpo.co.jp |
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